2166875 by HENKEL is a Bergquist Sil Pad TSP 1800 thermal interface product designed for efficient heat transfer in electronic components, featuring RoHS compliance and suitable for various electronic applications.
IBS Electronics uses cookies and similar technologies to gather data pertaining to your interactions and communications with our websites and services, encompassing session replay and chat session recordings. By continuing to use our websites, you signify your agreement with the terms stated in our Privacy Policy, express your consent for the use of cookies, tags, pixels, beacons, and other technologies, and confirm your acceptance of our website's Terms of Use.
.png){kind=logo}
