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NXP SEMICONDUCTORS BZV55C27115
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Technical
RoHS
Compliant
Lead Free
Lead Free
Mount
Surface Mount
Contact Plating
Tin
Element Configuration
Single
Number of Pins
2
Impedance
80 Ω
Zener Voltage
27 V
Power Dissipation
0.5 W
Max Reverse Leakage Current
0 A
Tolerance
5 %