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NXP SEMICONDUCTORS MC9S08DZ60AMLC
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Technical
RoHS
Compliant
Contact Plating
Tin
Case/Package
LQFP
Interface
CAN, I2C, LIN, SCI, SPI
Memory Type
FLASH
Core Architecture
S08
Peripherals
I2C, LVD, POR, PWM, WDT
Number of Pins
32
Number of I/Os
26
Min Supply Voltage
2.7 V
Max Supply Voltage
5.5 V
Memory Size
60 B
Data Bus Width
8 b