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NXP SEMICONDUCTORS MCF5475VR266
产品详情
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Technical
RoHS
Compliant
Lead Free
Lead Free
Case/Package
BGA
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Termination
SMD/SMT
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB
Memory Type
ROMless
Core Architecture
Coldfire
Peripherals
DMA, PWM, WDT
Number of Pins
388
Number of I/Os
99
Number of Bits
32
Memory Size
64 B
Max Frequency
266000000 Hz
Data Bus Width
32 b
Min Supply Voltage
1.43 V
Max Supply Voltage
3.6 V