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NXP SEMICONDUCTORS MCIMX6L3EVN10AB
产品详情
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Technical
RoHS
Compliant
Mount
Surface Mount
Interface
CAN, I2C, I2S, UART, USB
Memory Type
L2 Cache, ROM, SRAM
Case/Package
TFBGA
Contact Plating
Copper, Silver, Tin
Core Architecture
ARM
Number of Pins
432
Max Frequency
1000000000 Hz
Data Bus Width
32 b