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NXP SEMICONDUCTORS MM912F634DV1AE
产品详情
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Technical
RoHS
Compliant
Mount
Surface Mount
Case/Package
LQFP
Interface
LIN, SCI, SPI
Memory Type
FLASH
Contact Plating
Tin
Core Architecture
HCS12
Number of I/Os
9
Memory Size
32 B
Max Frequency
20000000 Hz
Data Bus Width
16 b
Min Supply Voltage
4.5 V
Max Supply Voltage
5.5 V