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NXP SEMICONDUCTORS S9S12DG12F1MPVE
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Technical
RoHS
Compliant
Mount
Surface Mount
Case/Package
LQFP
Packaging
Bulk
Contact Plating
Tin
Interface
CAN, I2C, SCI, SPI
Memory Type
FLASH
Peripherals
PWM, WDT
Core Architecture
HCS12
Number of Pins
112
Number of I/Os
91
Memory Size
128 B
Max Frequency
25000000 Hz
Data Bus Width
16 b