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TE CONNECTIVITY CRGP2010F330K

RES PULSE WITHSTAND THICK FILM 2010 330K OHM 1% 1.25W ±100PPM/°C MOLDED EMBOSS T/R

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Technical

Packaging
Cut Tape
Composition
Thick Film
Case/Package
2010
Lifecycle Status
Production (Last Updated: 5 days ago)
Resistance
330000 Ω
Power Rating
1.25 W
Temperature Coefficient
100 ppm/°C

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